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DISCRETE SEMICONDUCTORS
DATA SHEET
handbook, halfpage
M3D388
BGY1816S UHF amplifier module
Product specification Supersedes data of 1999 Jan 07 1999 Apr 13
Philips Semiconductors
Product specification
UHF amplifier module
FEATURES * 26 V nominal supply voltage * 16 W output power into a load of 50 with an RF drive power of 20 mW. APPLICATIONS * Base station transmitting equipment operating in the 1805 to 1880 MHz frequency band. DESCRIPTION The BGY1816S is a three-stage UHF amplifier module in a SOT501A package with a plastic cap. It consists of three NPN silicon planar transistor dies mounted together with matching and bias circuit components on a metallized ceramic AlN substrate. PINNING - SOT501A PIN 1 2 3 4 Flange RF input VS1 VS2 RF output ground
BGY1816S
DESCRIPTION
1 Front view
2
3
4
MBK760
Fig.1 Simplified outline.
QUICK REFERENCE DATA RF performance at Tmb = 25 C. MODE OF OPERATION CW f (MHz) 1805 to 1880 VS1 (V) 5 VS2 (V) 26 PL (W) 16 Gp (dB) 29 (%) 30 ZS; ZL () 50
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VS1 VS2 PD PL Tstg Tmb PARAMETER DC supply voltage DC supply voltage input drive power load power storage temperature operating mounting base temperature Tmb = 25 C CONDITIONS - - - -30 -10 MIN. 4.5 MAX. 5.5 28 120 20 +100 +90 V V mW W C C UNIT
1999 Apr 13
2
Philips Semiconductors
Product specification
UHF amplifier module
CHARACTERISTICS Tmb = 25 C; VS1 = 5 V; VS2 = 26 V; PL = 16 W; ZS = ZL = 50 unless otherwise specified. SYMBOL f IS1 IS2 PL Gp H2 H3 VSWRin PARAMETER frequency supply current supply current load power power gain efficiency second harmonic third harmonic input VSWR stability reverse intermodulation B AM bandwidth ruggedness VSWR 2 : 1 through all phases; PL 16 W; VS2 = 25 to 27 V Pcarrier = 16 W; Preverse = -40 dBc; fi = fc 200 kHz corner frequency = 3 dB; Pcarrier = 16 W; modulation = 20% VSWR 5 : 1 through all phases PD < -60 dBm PD < 20 mW CONDITIONS - - 16 29 30 - - - - - 2 MIN. 1805 - 80 430 - - - - - - - - - TYP.
BGY1816S
MAX. 1880 - - - - - -35 -40 2:1 -60 -53 -
UNIT MHz mA mA W dB % dBc dBc dBc dBc MHz
no degradation
1999 Apr 13
3
Philips Semiconductors
Product specification
UHF amplifier module
BGY1816S
handbook, full pagewidth
C7 C5
C8 C6
Z1
R1
L1
R2
L2
Z2
C3 C1 50 input
C4 C2 50 output
MGM861
VS1
VS2
Fig.2 Test circuit.
List of components (see Figs 2 and 3) COMPONENT C1, C2 C3, C4 C5, C6 C7, C8 L1, L2 R1, R2 Z1, Z2 Note 1. The striplines are on a double copper-clad printed-circuit board with epoxy dielectric (r = 4.5); thickness = 1 mm. DESCRIPTION electrolytic capacitor multilayer ceramic chip capacitor multilayer ceramic chip capacitor multilayer ceramic chip capacitor Grade 4S2 Ferroxcube bead metal film resistor stripline; note 1 10 ; 0.4 W 50 VALUE 10 F; 35 V 10 nF; 50 V 100 pF; 50 V 10 pF; 50 V 4330 030 36300 2322 195 13109 - CATALOGUE NO.
1999 Apr 13
4
Philips Semiconductors
Product specification
UHF amplifier module
BGY1816S
handbook, full pagewidth
90
45
C1 output 50
C3
C4
C2 input 50
R1
L1 L2 Ferroxcube 452
R2
Z2
C5 C7
C6 C8
Z1
MGR735
BGY1816S
Dimensions in mm.
Fig.3 Printed-circuit board component layout.
1999 Apr 13
5
Philips Semiconductors
Product specification
UHF amplifier module
MOUNTING RECOMMENDATIONS To ensure a good thermal contact and to prevent mechanical stress when bolted down, the flatness of the mounting base is designed to be typically better than 0.1 mm. The mounting area of the heatsink should be flat and free from burrs and loose particles. The heatsink should be rigid and not prone to bowing under thermal cycling conditions. The thickness of a solid heatsink should be not less than 5 mm to ensure a rigid assembly. A thin, even layer of thermal compound should be applied between the mounting base and the heatsink to achieve the best possible thermal contact resistance. Excessive use of thermal compound will result in an increase in thermal resistance and possible bowing of the mounting base; too little will also result in poor thermal conduction. The module should be mounted to the heatsink using 3 mm bolts with flat washers. The bolts should first be tightened to "finger tight" and then further tightened in alternating steps to a maximum torque of 0.4 to 0.6 Nm. Once mounted on the heatsink, the module leads can be soldered to the printed-circuit board. A soldering iron may be used up to a temperature of 250 C for a maximum of 10 seconds at a distance of 2 mm from the plastic cap. ESD precautions must be taken to protect the device from electrostatic damage.
BGY1816S
1999 Apr 13
6
Philips Semiconductors
Product specification
UHF amplifier module
PACKAGE OUTLINE
BGY1816S
Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads
SOT501A
D
vB
A F y
U q vC
B vB C A
U2 E P U1
L
1
2
3
bp
4
wM e2 d zA Q c
e
e1
0
10 scale
20 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 9.4 8.9 bp 0.56 0.46 c 0.3 0.2 D d E e e1 e2 F 3.1 2.9 L 6.5 6.1 P 3.6 3.4 Q 4.1 3.7 q U U1 U2 6.9 6.5 v 0.2 w 0.25 y 0.1 z 0.3
52.1 10.9 18.7 15.24 27.94 2.54 51.7 10.5 18.3
61.2 67.4 15.5 61.0 67.0 15.1
OUTLINE VERSION SOT501A
REFERENCES IEC JEDEC EIAJ
EUROPEAN PROJECTION
ISSUE DATE 98-10-28
1999 Apr 13
7
Philips Semiconductors
Product specification
UHF amplifier module
DEFINITIONS Data Sheet Status Objective specification Preliminary specification Product specification Limiting values
BGY1816S
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1999 Apr 13
8
Philips Semiconductors
Product specification
UHF amplifier module
NOTES
BGY1816S
1999 Apr 13
9
Philips Semiconductors
Product specification
UHF amplifier module
NOTES
BGY1816S
1999 Apr 13
10
Philips Semiconductors
Product specification
UHF amplifier module
NOTES
BGY1816S
1999 Apr 13
11
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA63
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
125002/00/03/pp12
Date of release: 1999 Apr 13
Document order number:
9397 750 05436

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